Extreme Copper PCB Assembly
NOD Electronics has many years of experience producing extreme copper PCB and low-quantity production runs with short lead times for many different types of applications. Copper weights above 20 oz/ft2 and up to 200 oz/ft2 are also possible and are referred to as extreme copper.
Extreme Copper PCB Assembly Capabilities
Maximum Number of Layers = 16
Laminate – FR-4 (All Tg Ranges), Teflon, Ceramic
Finished Thickness = .020" - .275"
Green, Blue, Red, Black, Clear & White Solder Masks & Legend Inks
Minimum Soldermask Clearance – 6 mils
Minimum Solder Dam Width – 5.5 mils
Hot Air Solder Leveling (HASL)
Immersion Gold (ENIG) & Immersion Silver
Blind & Buried Vias
Minimum Drill Bit Hole Size = .012"
Minimum Holes Size - .008" +.005"/-.008"
Maximum Hole Aspect Ratio = 10:1
Maximum Copper Weight = 6 oz. (UL Approved)
Controlled Impedance +/- 10%
Minimum Silkscreen Line Width – 8 mils
Extreme Copper PCB Assembly Process Control
NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.
To fulfill your time-to-market is our mission during the course of extreme copper PCB manufacturing. We will make you stay without any hassle since you pass the manufacturing order to NOD Electronics. Value-added manufacturing services will impress you. PCBs with extreme copper assembly offers multiple advantages over a conventional printed circuit board, and is an ideal fit for today’s high-demand electronic applications.
TAG:  PCB Assembly