ENIG PCB Manufacturing

The best features of ENIGs its flat surface and excellent solderability. The Electroless Nickel is an auto-catalytic process that deposits Nickel on a Palladium catalyzed Copper surface. Immersion Gold is replacement chemistry.

Type : Aluminum
Layer(s) : Double-sided
Laminate Thickness : 0.8mm
Copper Thickness : 0.5oz
Surface Finish : ENIG
Transport Package : Vacuum
Certificates : RoHS

ENIG PCB Manufacturing

The best features of ENIGs its flat surface and excellent solderability. The Electroless Nickel is an auto-catalytic process that deposits Nickel on a Palladium catalyzed Copper surface. Immersion Gold is replacement chemistry. In other words, it attaches to the Nickel by replacing atoms of Nickel with atoms of Gold. The recommended Gold thickness is 2-4 µin. The purpose of the immersion Gold layer is to protect the Nickel surface and maintain its solderability.


Our Capabilities of PCB Manufacturing

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1


NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our PCB board fabrication capabilities can meet almost 95% demand of custom requirements and actually we concentrated on this field for decades.


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