CEM-3 PCB Assembly

Quick turn CEM-3 laminate PCB assembly services with high quality and in compliance with ISO9001, UL, CE, RoHS and IPC-A-610E.

Type : Rigid
Layer(s) : Double-sided
Laminate Thickness : 0.8mm
Copper Thickness : 0.5oz
Surface Finish : OSP
Transport Package : Carton
Certificates : TS16949

CEM-3 PCB Assembly Services

Rigid (FR-4, CEM-1, CEM-3) laminate is widely applied for PCB manufacturing due to its cost efficiency and stability. Our advanced 7 SMT lines and 4 through hole production lines ensure low to high volume of PCB fabrication, assembly and box building. All process control is under IPC-A-610E, ISO9001:2008 and verified by RoHS, UL, CE, TS16949. Our responsive team will offer outstanding services in compliance with quality commitment.

CEM-3 PCB Assembly Manufacturing Capabilities

7 SMT linesUp to 12 layers, blind and buried viaSamsung SM471
impedance, heavy copper, HDI.Fuji CP8 series
4 DIP & Box Building LinesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
SMT 4 million spot dailyBurn in testWave soldering (lead-free)
DIP 1 million spot dailyBox Building

CEM-3 PCB Assembly Process Chart


TAG:  FR-4 PCB Assembly CEM-3