BGA PCB Assembly

AIRMEND has a vast amount of processing experiences in Ball Grid Array Assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment.

Type : Rigid
Layer(s) : Double-sided
Laminate Thickness : 1.0mm
Copper Thickness : 0.5oz
Surface Finish : OSP
Transport Package : Foam
Certificates : ISO9001

BGA PCB Assembly

AIRMEND has a vast amount of processing experiences in Ball Grid Array Assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment. We have developed over the years BGA assembly processes with a proven record of producing BGA circuit boards with excellent yield rates and the highest quality in the electronics manufacturing industry.

BGA PCB Assembly Capabilities

PCB Assembly ManufacturingAvailable PCB Assembly ServicesPCB Assembly Machines
4 SMT linesUp to 12 layers, blind and buried via, impedance, heavy copper, HDI.Fuji CP8 series SMT mounters
2 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
SMT 4 million spot dailyBurn in testWave soldering (lead-free)
DIP 1 million spot dailyBox BuildPCB assembly test room

BGA PCB Assembly Process Control

AIRMEND fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

PCB Assembly Process

Apart from these, we can also provide rework and reballing services for BGAs that are already in use. Our rework and reballing capabilities include BGA removal and replacement, rework of ceramic and plastic BGAs and reballing of MBGAs. NOD Electronics becomes a one stop destination for all your BGA assembly services.