BGA PCB Assembly
AIRMEND has a vast amount of processing experiences in Ball Grid Array Assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment. We have developed over the years BGA assembly processes with a proven record of producing BGA circuit boards with excellent yield rates and the highest quality in the electronics manufacturing industry.
BGA PCB Assembly Capabilities
|PCB Assembly Manufacturing||Available PCB Assembly Services||PCB Assembly Machines|
|4 SMT lines||Up to 12 layers, blind and buried via, impedance, heavy copper, HDI.||Fuji CP8 series SMT mounters|
|2 DIP lines||SMT/DIP||Auto solder paste screen printer|
|0201 component||In circuit test||Reflow ovens with 10 zones|
|0.25mm BGA||Function circuit test||Auto optical inspection|
|SMT 4 million spot daily||Burn in test||Wave soldering (lead-free)|
|DIP 1 million spot daily||Box Build||PCB assembly test room|
BGA PCB Assembly Process Control
AIRMEND fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.
Apart from these, we can also provide rework and reballing services for BGAs that are already in use. Our rework and reballing capabilities include BGA removal and replacement, rework of ceramic and plastic BGAs and reballing of MBGAs. NOD Electronics becomes a one stop destination for all your BGA assembly services.