High Performance PCB Assembly

AIRMEND use a mixture of automation and highly skilled manual assembly techniques. Naked die and packaged components can be assembled on the same substrate giving very high performance boards.

Type : Rigid
Layer(s) : Double-sided
Laminate Thickness : 1.0mm
Copper Thickness : 1oz
Surface Finish : HSAL
Transport Package : Vacuum
Certificates : UL

High Performance PCB Assembly

AIRMEND use a mixture of automation and highly skilled manual assembly techniques. Naked die and packaged components can be assembled on the same substrate giving very high performance boards.

High Performance PCB Assembly Capabilities

PCB Assembly ManufacturingAvailable PCB Assembly ServicesPCB Assembly Machines
4 SMT linesUp to 12 layers, blind and buried via, impedance, heavy copper, HDI.Fuji CP8 series SMT mounters
2 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
SMT 4 million spot dailyBurn in testWave soldering (lead-free)
DIP 1 million spot dailyBox BuildPCB assembly test room

High Performance PCB Assembly Process Control

AIRMEND fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

PCB Assembly Process

AIRMEND has the global technology, facilities and supply chains necessary to ensure rapid quoting and prototyping, as well as, a seamless and expedited transition to a high-volume manufacturing environment. AIRMEND offers real-time collaboration, end-to-end project tracking and management, consistent quality control across facilities and the shortest time-to-market possible.