BGA Soldering PCB Assembly
The Ball Grid Array or BGA, is a very different package to those using pins, such as the quad flat pack. The pins of the BGA package are arranged in a grid pattern and this gives rise to the name. In addition to this, rather than having the more traditional wire pins for the connections, pads with balls of solder are used instead. On the printed circuit board, PCB, onto which the BGA components are to be fitted there is a matching set of copper pads to provide the required connectivity.
BGA Soldering PCB Assembly Capabilities
|PCB Assembly Manufacturing||Available PCB Assembly Services||PCB Assembly Machines|
|4 SMT lines||Up to 12 layers, blind and buried via, impedance, heavy copper, HDI.||Fuji CP8 series SMT mounters|
|2 DIP lines||SMT/DIP||Auto solder paste screen printer|
|0201 component||In circuit test||Reflow ovens with 10 zones|
|0.25mm BGA||Function circuit test||Auto optical inspection|
|SMT 4 million spot daily||Burn in test||Wave soldering (lead-free)|
|DIP 1 million spot daily||Box Build||PCB assembly test room|
BGA Soldering PCB Assembly Process Control
AIRMEND fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.
AIRMEND has a vast amount of expertise in Ball Grid Array Assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment. We have developed over the years BGA assembly processes with a proven record of producing BGA circuit boards with excellent yield rates and the highest quality in the electronics manufacturing industry.