Sensor Carbon Ink PCB Assembly
For Sensor Carbon Ink PCB assembly, this PCB assembly from AIRMEND is based on an HDI board, and integrates 0201, 0402, 0603, 0805, 1210 and 2512 components. SMT and DIP processes are used. The unit undergoes automated optical inspection, and in-circuit and functional testing. Production complies with IPC-A-160 requirements.
Sensor Carbon Ink PCB Assembly Capabilities
|PCB Assembly Manufacturing||Available PCB Assembly Services||PCB Assembly Machines|
|4 SMT lines||Up to 12 layers, blind and buried via, impedance, heavy copper, HDI.||Fuji CP8 series SMT mounters|
|2 DIP lines||SMT/DIP||Auto solder paste screen printer|
|0201 component||In circuit test||Reflow ovens with 10 zones|
|0.25mm BGA||Function circuit test||Auto optical inspection|
|SMT 4 million spot daily||Burn in test||Wave soldering (lead-free)|
|DIP 1 million spot daily||Box Build||PCB assembly test room|
Sensor Carbon Ink PCB Assembly Process Control
AIRMEND fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.
AIRMEND's motto is quality, efficiency and competitive price. We strictly adhere to the TS14969 standards, and continuously apply advanced international technology to improve the quality of the product to meet needs of our customers.