Sensor Carbon Ink PCB Assembly

For Sensor Carbon Ink PCB assembly, this PCB assembly from AIRMEND is based on an HDI board, and integrates 0201, 0402, 0603, 0805, 1210 and 2512 components.

Type : Rigid
Layer(s) : 4
Laminate Thickness : 1.0mm
Copper Thickness : 1oz
Surface Finish : ENIG
Transport Package : Vacuum
Certificates : CE

Sensor Carbon Ink PCB Assembly

For Sensor Carbon Ink PCB assembly, this PCB assembly from AIRMEND is based on an HDI board, and integrates 0201, 0402, 0603, 0805, 1210 and 2512 components. SMT and DIP processes are used. The unit undergoes automated optical inspection, and in-circuit and functional testing. Production complies with IPC-A-160 requirements.

Sensor Carbon Ink PCB Assembly Capabilities

PCB Assembly ManufacturingAvailable PCB Assembly ServicesPCB Assembly Machines
4 SMT linesUp to 12 layers, blind and buried via, impedance, heavy copper, HDI.Fuji CP8 series SMT mounters
2 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
SMT 4 million spot dailyBurn in testWave soldering (lead-free)
DIP 1 million spot dailyBox BuildPCB assembly test room

Sensor Carbon Ink PCB Assembly Process Control

AIRMEND fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

PCB Assembly Process

AIRMEND's motto is quality, efficiency and competitive price. We strictly adhere to the TS14969 standards, and continuously apply advanced international technology to improve the quality of the product to meet needs of our customers.