0201 PCB Assembly
The continued drive toward miniaturization has seen component sizes decrease while board densities have increased. The world's most advanced semiconductor packages are facing new challenges with the adoption of 0201 passive components. These challenging components will push high-speed assembly equipment to even more exacting parameters.
0201 PCB Assembly Capabilities
|PCB Assembly Manufacturing||Available PCB Assembly Services||PCB Assembly Machines|
|4 SMT lines||Up to 12 layers, blind and buried via, impedance, heavy copper, HDI.||Fuji CP8 series SMT mounters|
|2 DIP lines||SMT/DIP||Auto solder paste screen printer|
|0201 component||In circuit test||Reflow ovens with 10 zones|
|0.25mm BGA||Function circuit test||Auto optical inspection|
|SMT 4 million spot daily||Burn in test||Wave soldering (lead-free)|
|DIP 1 million spot daily||Box Build||PCB assembly test room|
0201 PCB Assembly Process Control
AIRMEND fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.
AIRMEND is based in China and provides a quality PCB assembly service including single & double sided SMT board assembly and fine pitch component placement from 0201 through to 50 x 50mm QFP’s including BGA’s and QFN’s. Our flexibility in satisfying existing and prospective customer’s needs coupled with our responsive behavior to their specific requirements plays a key role in our continued success – 7 years in the making.
TAG:  PCB Assembly