In order to ensure the stability and reliability of PCBA products, after the completion of PCBA production, it is best to carry out an aging test. The main purpose of the aging test is to simulate the daily use environment of the product to expose the defects of the PCBA, such as the defects of the products, such as the high temperature, low temperature, high and low temperature changes and electrical power. Bad welding, mismatch of component parameters, and fault caused in the process of debugging, in order to eliminate and improve, it will play the role of stable parameters to the PCBA board without defect.
There are 3 standards for PCBA aging test. According to these 3 standards, general problems can be found.
1、low temperature work: put the control board at the temperature at -10±3℃ in 1 hour. Under the conditions of rated load with 187V and 253V, all programs are operated by electricity, and the program should be correct.
2、high temperature work: the control board is placed at 80±3℃ in 1 hour. Under the conditions of rated load with 187V and 253V, all programs are operated by electricity, and the program should be correct.
3、high temperature and high humidity work: the control board under the temperature 65±3℃, humidity 90-95% conditions in 48 hours, with the rated load operation of the program, the procedures should be correct.