Currently, many electronic products are designed concurrently with new manufacturing processes to produce them. The overall quality of the design and manufacturing processes have to be determined, and an overall quality plan has to be in place in preparation for new product introduction. This quality plan should include the design review and selection of the most cost-effective product and constituent parts and assembly specifications, using tools such as QFD, discussed in Chapter 1. The design quality analysis of major circuits, subassemblies, and modules discussed in this chapter has to be performed to determine design-related defects. These design analyses tend to be discipline-specific, and the final product analysis could include trade-offs in the design quality of these elements. In addition, current and new production lines should be optimized for least variability using DoE to ensure the attainment of the six sigma goals in design and PCB assembly.
Six sigma strategy for new product introduction includes making sure that new manufacturing processes are optimized for meeting design goals and producing the least amount of variability, as well as examining the total defects generated by new product design and manufacturing in the prototype stages of design. These defects could be reduced by redesigning the lowest-rated designs, or by optimizing the final product through trade-offs in the different design disciplines.
The test strategy for the quality plan includes where and how the defects will be removed and using the most economic methods of removal. Many issues in the test strategy for PCBs and products were discussed in Chapter 4.